SemiconductorX – The Chip Supply Chain, from Quartz to Module

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Design. Fabricate. Scale.

A leading-edge chip passes through more than a dozen stages in as many countries before it reaches a server, a car or a robot. SemiconductorX maps each stage: the materials, the wafer fabs and the 80-to-120-pass loop inside them, the tools, the packaging, and the companies that hold each step. For every stage it asks one question: how much of it is made in the United States today.

US PRODUCTION BY STAGE, LATE 2026

01 Quartz and polysilicon Spruce Pine, NC Hemlock, MI

02 Silicon wafers GlobalWafers Sherman, TX

03 Photoresist TOK Hillsboro, OR i-line only

04 Gallium and germanium China: about 99% of primary gallium

05 Chip design software Synopsys, Cadence

06 Lithography ASML; EUV source from San Diego

07 Deposition, etch, inspection Applied Materials, Lam, KLA

08 Leading-edge logic TSMC Arizona N4, Intel 18A

09 HBM Micron Boise 2027, SK hynix IN 2029

10 Package substrates Absolics, GA; ABF film: Japan

11 Advanced packaging Amkor Peoria, AZ 2028

12 Chip testers Teradyne testers built in Asia

Made in US

Some US volume

US planned

Made abroad

Hubs

9

Made in US at scale

3 of 12 stages

Fab dataset

158 fabs in 17 countries

Spotlights

16 companies and systems

Hubs

Materials, process, equipment and packaging follow the wafer from quartz to a finished module. Fabs, chips and sectors show where it is made and where it goes. Spotlights and the supply-chain hub read the whole chain for one company, one system or one country.

Process

How a wafer becomes a chip: the front-end loop of clean, deposit, pattern, etch and measure that repeats 80 to 120 times, then wafer test, assembly and module integration.

Materials

Quartz, polysilicon and wafers, the gases, chemicals and resists the fab consumes, and the critical elements China controls.

Equipment

The tools that run each step: ASML lithography, Applied Materials, Lam and Tokyo Electron deposition and etch, KLA inspection, and the testers and bonders of the back end.

Where AI chips are now assembled into one machine: CoWoS, SoIC, EMIB and Foveros, the substrates under them and the OSATs that run them.

Chips

Logic, memory, power, analog, RF, optoelectronic and sensor chips: what each does, who makes it and on which process.

Fabs

The 158 fabs and packaging plants in the SemiconductorX dataset, read by type: leading-edge and mature logic, DRAM, NAND, SiC, GaN, analog, image sensors and more. The utilities that keep them running, power, ultrapure water, cleanrooms and gas delivery, sit alongside.

Where the chips go: AI and data centers, vehicles, robots and humanoids, phones and PCs, telecom, energy, space and defense.

Spotlights

One company or system read through its whole supply chain: NVIDIA, TSMC, ASML, Samsung, Huawei, Wolfspeed and the Tesla Terafab.

Supply Chain

The bottlenecks that set the pace, how much of each stage is coming back to the US, the policy and risk behind it, and the workforce it needs.